- ORDER of USCA (Certified Copy) as to Sean Combs re: 21 Notice of Appeal - Interlocutory USCA Case Number 24-2606. Appellant Sean Combs moves for bail and for immediate release pending disposition of the bail motion. He also requests leave to file his bail motion under seal with partial redactions. IT IS HEREBY ORDERED that the motion for bail is REFERRED to a three-judge panel. The request for immediate release pending decision on the bail motion by a three-judge panel is DENIED. The motion to seal is GRANTED. Catherine O’Hagan Wolfe, Clerk USCA for the Second Circuit, Clerk USCA. Certified: 10/10/2024. (tp) (Entered: 10/11/2024)
- Die shrink: How Intel scaled down the 8086 processor (righto.com)
The revolutionary Intel 8086 microprocessor was introduced 42 years ago this month so I’ve been studying its die.1 I came across two 8086 dies with different sizes, which reveal details of how a die shrink works. The concept of a die shrink is that as technology improved, a manufacturer could shrink the silicon die, reducing costs and improving performance. But there’s more to it than simply scaling down the whole die. Although the internal circuitry can be directly scaled down,2 external-facing features can’t shrink as easily. For instance, the bonding pads need a minimum size so wires can be attached, and the power-distribution traces must be large enough for the current. The result is that Intel scaled the interior of the 8086 without change, but the circuitry and pads around the edge of the chip were redesigned.